Xilinx and Cadence Solution Speeds Multi-Gigabit Designs for System Companies
Xilinx(R) RocketIO(TM) Design Kit for Cadence SPECCTRAQuest(TM)
Reduces Time to Simulate from Weeks to Days
SAN JOSE, Calif.--(BUSINESS WIRE)--Feb. 17, 2003--
Cadence Design Systems, Inc. (NYSE:CDN) and Xilinx, Inc.
(Nasdaq:XLNX) today announced the adoption of the Xilinx RocketIO(TM)
Design Kit for SPECCTRAQuest by over 500 designers and engineers. The
wide adoption is a result of the Xilinx and Cadence alliance developed
to enable designers to exploit the enormous capacity and system
performance of the Xilinx Virtex-II Pro(TM) FPGA. The kit, an
electronic blueprint for simulating and implementing Virtex-II Pro
Rocket IO transceivers in a system, speeds time-to-market and lowers
development costs, both of which are critical to systems companies'
ability to meet their profit goals.
The Xilinx Virtex-II Pro family, shipping since March 2002, leads
the industry in density, performance, memory, DSP processing, embedded
processing and value and is the world's first and only FPGA to offer
integrated PowerPC microprocessor technology and 3.125 Gbps serial
transceivers. Virtex-II Pro devices include these multiple PowerPC
CPUs and multi-gigabit serial transceivers at no additional charge,
providing unequaled capability and value for today's system design
requirements.
The Xilinx RocketIO Design Kit for SPECCTRAQuest, introduced March
13, 2002, enables engineers to be quickly productive in creating,
implementing, and verifying gigahertz-speed serial links using the
multi-gigabit IO technology. Operating within the Cadence(R)
SPECCTRAQuest(TM) Signal Integrity Expert environment, it provides a
proven approach to characterizing the interactions between the Xilinx
Platform FPGA and the rest of the system. Designed to address the
time-consuming PCB level simulation and implementation challenges
created by gigahertz speed systems, the design kit helps shorten
design cycles. "The new RocketIO Design Kit saved me a lot of time,
particularly for multi-board simulations that involve different styles
of routed differential pairs," said Mohammad W. Ali, Ph.D.,
technologist, Tellabs. "With the new interfaces in SPECCTRAQuest, I
can accomplish the simulation task 10 to 20 times faster than before."
"In only 10 minutes after installing the RocketIO Design Kit, I
was able to begin simulating my multi-gigabit solution," said Wenwei
Qiao, engineer, Applied Materials.
According to Stephane Tessier, hardware engineer at Radical
Horizon, a Montreal-based Software Defined Radio (SDR) solution
provider, "The Kit is a 'must have' for developing multi-gigabit
links. The tutorial information reduces an engineer's learning curve,
and use of the kit will reduce the number of board iterations."
"The SPECCTRAQuest design kit helps reduce the time to implement
new silicon into a system because it takes advantage of concurrent
design efficiencies, using technologies that address silicon, package
and board design," said Charlie Giorgetti, Cadence vice president and
general manager of the PCB Systems Division.
Time Saving Result of Unique Features in Design Kit
The RocketIO Design Kit for SPECCTRAQuest design kit allows
engineers to develop optimal constraints for their PCB systems. These
constraints then drive PCB floorplanning, routing, and verification
process. The RocketIO Design Kit for SPECCTRAQuest includes the
following:
|
-- | Ready-to-simulate system level topologies for typical use of
the device on the board/system;
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-- | Verified IO buffer models;
|
-- | Large Package Model;
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-- | Test bench data, Correlation data;
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-- | Connector models for backplane applications;
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-- | Device specific scripts/tools to evaluate simulation results;
|
-- | A video that describes how to get started with the design kit
in the end users environment.
|
"Our customers' ability to quickly design-in the Virtex II Pro
Rocket IO technology is critical," said Rich Sevcik, senior vice
president and general manager of FPGA products at Xilinx. "Working
with Cadence, we are minimizing the design-in time for our mutual
customers, enabling customers to take advantage of dramatic system
cost savings through the implementation of the serial technology in
their next design."
Cadence Chip Enablement Initiative
This announcement aligns with the Cadence Chip Set Enablement
Initiative that supports IC manufacturers in speeding the design-in of
their advanced chips into systems, speeding design-to-volume for both
themselves and their systems customers.
Price and Availability
The RocketIO Design Kit for SPECCTRAQuest is provided free to
Xilinx customers who have the appropriate non-disclosure agreement in
place. More information is available at http://support.xilinx.com. The
Cadence SPECCTRAQuest Signal Integrity Expert product starts at a U.S.
list price of $24,200 for a one-year license. For pricing outside of
North America, contact your local Cadence office or distributor. More
information regarding other Serial Tsunami design resources is
available at http://www.xilinx.com/serialsolution.
About Xilinx
Xilinx is the worldwide leader in complete programmable logic
solutions. For more information, visit www.xilinx.com.
About Cadence
Cadence is the largest supplier of electronic design technologies,
methodology services, and design services. Cadence solutions are used
to accelerate and manage the design of semiconductors, computer
systems, networking and telecommunications equipment, consumer
electronics, and a variety of other electronics-based products. With
approximately 5,300 employees and 2002 revenues of approximately $1.3
billion, Cadence has sales offices, design centers, and research
facilities around the world. The company is headquartered in San Jose,
Calif., and traded on the New York Stock Exchange under the symbol
CDN. More information about the company, its products and services are
available at www.cadence.com.
Cadence and the Cadence logo are registered trademarks and
SPECCTRAQuest is a trademark of Cadence Design Systems, Inc. All other
trademarks and registered trademarks are property of their respective
holders.
CONTACT: Cadence Design Systems, Inc.
PCB Systems Division
Meg Kenagy, 503/968-4842
mkenagy@cadence.com
or
Xilinx, Inc.
Public Relations
Tamara Snowden, 408/879-6146
tamara.snowden@xilinx.com